TY - CPAPER T1 - Development and challenge of paste technology in China T2 - Paste 2017: 20th International Seminar on Paste and Thickened Tailings AU - Wu, AX AU - Cheng, H AU - Yang, Y AU - Zhang, L ED - Wu, A A2 - Wu, A ED - Jewell, R A2 - Jewell, R DA - 2017/06/16 PY - 2017 PB - University of Science and Technology Beijing PP - Beijing CY - Beijing C1 - Beijing SP - 2 EP - 11 UR - https://papers.acg.uwa.edu.au/p/1752_01_Wu/ ER - DO - 10.36487/ACG_rep/1752_01_Wu